• Static dissipative top and bottom layers
• Buried conductive layer
  Consists of three layers, static dissipative top and
  bottom surfaces and a conductive inner layer. The buried
  conductive layer (10³–10⁴Ω) is inaccessible except through
  a properly installed groundable snap. This feature reduces
  potential for damage from a spark induced EMP and ensures
  employee safety.
• Resistance to ground 1.0 x 10⁹Ω
• Very high temperature resistance – resistant to solder
  drips
• Meets or exceeds MIL-W-87893A, IEC 61340-5,
  DOD-HDBK-263,DOD-STD-1686