Loctite’s chipbonder range offers assembly solutions to match the different SMA application technologies; syringe dispensing, printing and pin-transfer. The use of Loctite Chipbonder SMA ensures outstanding performance for each application method.
Available in syringe dispense grades and stencil printing grades.
Features Include
• Dot deposition without stringing
• Consistent dot shape
• Component adaptability
• High wet strength
• Flexible curing properties
• High thermal shock properties